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Custom Semiconductor Wafer Etching Processing Equipment

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Common Semiconductor Equipment

Chemcut’s semiconductor equipment is an excellent choice for non-traditional processing of semiconductor wafers: 

  • Wafer Cleaning 
  • Aqueous Wafer Photoresist Developing 
  • Aqueous Wafer Photoresist Stripping 
  • Silicon Wafer Etching 
  • Glass Wafer Etching 
  • Wafer Metal Etching 

 

Chemcut’s Wafer Processing Equipment

Chemcut’s continuous horizontal conveyor system allows for parallel processing of multiple pieces and can transport wafers, disks, squares, rectangles, and irregular shapes. 

The standard conveyor requires a minimum piece size of 5 X 6 inches; however, depending upon the processes needed, conveyor options may be available to accommodate smaller materials. 

We manufacture systems with useable conveyor widths from 15-60 inches, and a variety of machine lengths are available to match the required throughput rate. 

Non-metallic and premium metal construction components ensure compatibility with a wide range of aqueous process solutions, including hydrofluoric acid and organic solvents. All equipment is built with fire retardant materials and applicable to SEMI specifications. 

Optional materials are available for Class 100 clean rooms. 

Customize Your Silicon Wafer Etching Process 

Our equipment will be custom designed to meet your needs and specifications.  

We have designed and built many custom semiconductor cleaning machines, wafer photoresist strippers, and Si wafer etching machines. We also have an R&D lab where we can test any chemistry and do etch rate tests to validate the process prior to manufacturing.  

Whether you are cleaning, developing, stripping, or etching silicon wafers, Chemcut can build a custom machine for you. 

 

XLi Chemical Cleaning System
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
XLi Etching Systems
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
XLi Developing Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
XLi Stripping Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Metal Resist Stripper
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Potassium Hydroxide
  • Sodium Hydroxide
XLi with External Automatic Pressure Adjust
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Control the spray pressure of each spray tube using the PLC instead of the throttling screw.

Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
121 Brush Cleaner
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Features
  • Wet Brushing
  • Oscillating Brushes
  • Choice of bristle or compressed brushes
Common uses
  • Brushing
  • Cleaner
  • Finishing
  • Remove Polishing
2300 Series Chemical Cleaning System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
2300 Series Etching System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
2300 Series Dryer
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
  • 40″
Features
  • Stand-alone drying system
  • Portable unit (move anywhere in the shop) or fix it in place
2300 Series Stripping System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Metal Resist Stripper
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Potassium Hydroxide
  • Sodium Hydroxide
2300 Series Developing System
image
Available Conveyor Widths
  • 15″
  • 20″
  • 30″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
Common Resists
  • dry film photoresists
  • liquid photoresists
  • Aqueous solder mask resist (dry and liquid)
  • And many more resists
CC8000 Chemical Cleaning System
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Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Cleaner (Stand Alone)
  • Alkaline Clean to Acid Clean
  • Custom Size (1 to as many chambers as you want)
Common Chemicals
  • Acid Cleaner
  • Alkaline Cleaner
CC8000 Developing Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • Developer (Stand Alone)
  • DES (Develop – Etch – Strip)
Common Chemicals
  • 1% Potassium Carbonate
  • 1% Sodium Carbonate
Common Resists
  • dry film photoresists
  • liquid photoresists
  • Aqueous solder mask resist (dry and liquid)
  • And many more resists
CC8000 Etching Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • Etcher (Stand Alone)
  • SES (Strip – Etch – Strip)
Common Chemicals
  • Alkaline Etchant
  • Cupric Chloride Etchant
  • Ferric chloride Etchant
  • Hydrofluoric Acid (HF)
  • Micro etch
Common Materials Etched
  • Aluminum
  • Copper
  • Glass
  • Steel
  • Titanium
  • And more
CC8000 Stripping Systems
image
Available Conveyor Widths
  • 20″
  • 30″
  • 40″
  • 50″
  • 60″
Common Processes
  • Custom Size (1 to as many chambers as you want)
  • DES (Develop – Etch – Strip)
  • SES (Strip – Etch – Strip)
  • Stripper (Stand Alone)
Common Chemicals
  • Sodium Hydroxide
  • Potassium Hydroxide
  • Proprietary Aqueous or Semi-Aqueous Stripper
  • Metal Resist Stripper
Etch Adjust Module (EAM)
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Add EAM to
  • CC8000 Etching Systems
  • XLi Etching Systems
Advantages
  • Plated boards: Correct side to side etch difference when one side is plated more
  • Fine-tune very small features

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