Photoresist developing systems, Copper developing, pcb developing and semiconductor developing

Product Lines

Common Photoresist Developing Machines

    • Dry film photoresists
    • Liquid photoresists
    • Solder mask resist (dry and liquid)

      photoresist developing system, metal developing, Steel developing

Photoresist Developing Parameters  

    • Speed range: 14 – 140 inches / minute
    • Max temperature: 90 °F
    • pH range 10.7 – 11

Important Pre Developing Steps

    • Alkaline Clean or Alkaline and Acid Clean
        • Cleaning the metal surface is extremely important when it comes to wet processing. A clean surface means no dirt to interfere with the exposure step and it helps significantly with lamination adhesion.
        • To increase lamination adhesion for chemical milling companies, they should make their rinses after the acid clean acidic. An acidic rinse will create an acid surface that reacts with the lamination to help with adhesion.
        • To increase lamination adhesion for the PCB industry companies will micro etch the surface prior to lamination.
    • Lamination
    • Exposure

Important Post Developing Steps

    • Optional Step to Increase Lamination Adhesion
        • UV Bump or Bake
    • Etch
    • Strip


    • Feed and bleed
    • pH control
    • Panel counting
    • Filtration
    • Drying
    • And More

Learn more about our Developing equipment by looking at our products or contacting us or your local Chemcut sales agent.